Intel Desktop Haswell Prosesor

Cache		Page Size
Name	Level	4 kB	2 MB	1 GB
DTLB	1st	64	32	4
ITLB	1st	128	8/logical core	none
STLB	2nd	1024		none

The Haswell Desktop chip cenderung hanya membuat jalan mereka ke dalam keluarga iMac Apple, seperti Mac mini menggunakan chip mobile Mac Pro mengambil keuntungan dari Xeon-merek chip server. Namun, kemajuan pada Haswell set panggung untuk perbaikan lebih lanjut untuk hanya didesain ulang-andalan Apple Mac Desktop, dan chip mobile yang akan kekuatan sebagian besar sisa lineup Mac Apple harus mengikuti relatif segera setelah.

Design

 Haswell wafer with a pin for scale.

The Haswell architecture is designed specially to optimize the power savings and performance benefits from the move to FinFET transistors on the improved 22 nm process node.

Haswell is expected to launch in three major forms:

(1) Desktop version (LGA1150 socket): Haswell-DT

(2) Mobile/Laptop version (PGA socket): Haswell-MB

(3) BGA version:

(a) 47W and 57W TDP classes: Haswell-H (For "All-in-one" systems, Mini-ITX form factor motherboards, and other small footprint formats.)

(b) 13.5W and 15W TDP classes (SoC): Haswell-ULT (For Intel's UltraBook platform.)

(c) 10W TDP class (SoC): Haswell-ULX (For tablets and certain UltraBook-class implementations.)

NOTE:

ULT = Ultra Low TDP; ULX = Ultra Low eXtreme TDP.

Only certain BGA versions will receive GT3 integrated graphics. All other models will get GT2 (Intel HD 4600) integrated graphics.

Due to low power requirements of tablet and UltraBook platforms, Haswell-ULT and Haswell-ULX will only be available in dual-core. All other versions will be available in dual- or quad-core variants.

Performance

Compared to Ivy Bridge (expected):

Twice the vector processing performance.

At least 10% sequential CPU performance increase (8 execution ports per core versus 6).

Up to double the performance of the integrated GPU. (Haswell GT3 vs Ivy Bridge HD4000)

Technology

Features carried over from Ivy Bridge

A 22 nm manufacturing process.

3D tri-gate transistors.

A 14-stage pipeline (since the Core microarchitecture).

Mainstream up to quad-core.

Native support for dual channel DDR3.

64 kB (32 kB Instruction + 32 kB Data) L1 cache and 256 kB L2 cache per core.

Confirmed new features

Haswell New Instructions (includes Advanced Vector Extensions 2 (AVX2), gather, bit manipulation, and FMA3 support).^[17]

New sockets — LGA 1150 for desktops and rPGA947 & BGA1364 for the mobile market. It is possible that Socket R3 will replace LGA 2011 for server Haswells

Intel Transactional Synchronization Extensions (TSX).

Graphics support in hardware for Direct3D 11.1 and OpenGL 4.0.

DDR4 for the enterprise/server variant (Haswell-EX).

Variable Base clock (BClk) like LGA 2011.

Supervisor mode access prevention (SMAP)

Expected features

Shrink PCHfrom 65 nm to 32 nm.

A new cache design.

Up to 32MB Unified cache LLC (Last Level Cache).

Support for Thunderbolt technology.

There will be three versions of the integrated GPU: GT1, GT2, and GT3. According to vr-zone, the fastest version (GT3) will have 20 execution units (EU).Another source, SemiAccurate, however says that the GT3 will have 40 EUs with an accompanying 64MB cache on an interposer.An additional source, AnandTech, agrees that GT3 will have 40 EUs, and states there will be a version with up to 128MB of embedded DRAM, but makes no mention of an interposer. Haswell's predecessor, Ivy Bridge, has a maximum of 16 EUs.

New advanced power-saving system.

Fully integrated voltage regulator, thereby moving a component from the motherboard onto the CPU.

37, 47, 57W thermal design power (TDP) mobile processors.

35, 45, 65, 84, and ~100W+ (high-end, Haswell-E) TDP desktop processors.

10W TDP processors for the Ultrabook platform (multi-chip package like Westmere) leading to reduced heat which results in thinner as well as lighter Ultrabooks, but performance level will be lower than the 17W version.